How Does Rework and Repair Affect Costs in Flexible Printed Circuit Board?
Repair Affect Costs in Flexible Printed Circuit Board
Flexible printed circuit board, also known as flex PCBs, are a modern alternative to traditional copper wires and rigid PCBs. These multi-layered circuits are used in a variety of applications such as calculators, cell phones and printers. In addition, flex circuits can be found in a number of industries including automotive, medical and aerospace/military.
They provide a number of advantages, including increased density, better thermal management and greater flexibility in the design process. However, if the flex circuit is not properly handled and treated during assembly, it can become damaged. To avoid this, manufacturers should follow a few key guidelines to ensure that the flex PCBs are properly assembled and protected during operation.
The costs associated with rework and repair can have a significant impact on the price of a finished product. In order to minimize the cost of rework and repair, it is important to establish a detailed flexible printed circuit board assembly procedure for your in-house or contract manufacturing operation. The procedures should cover everything from soldering and desoldering to replacing components and re-plating gold contacts. These procedures should be outlined in a document, and should be updated regularly to reflect changes in equipment or changes in the recommended process.
How Does Rework and Repair Affect Costs in Flexible Printed Circuit Board?
Removing and reattaching a component on a PCB can be challenging. The process is not only time consuming, but it can also be damaging to the board. To reduce the risk of damage during rework, it is important to preheat the board prior to removing SMT components. This will minimize thermal shock and speed up the rework process. In addition, it is a good idea to use a hotplate-style preheater or infrared heater to maintain heat during the rework process.
It is also important to use a high-quality solder paste that has been optimized for the flexible PCB application. In addition, the solder paste should be formulated to prevent delamination. Delamination is a common problem in PCBs and can lead to the destruction of the flexible circuits. Using a low-melting solder paste can help prevent delamination, which will reduce the chance of defects and failures in the future.
The rework process must be carefully planned and executed to ensure the correct placement of components. This is especially true for taller components, which may require extra space to be accessed. Clearly labeling I/O ports will help to make it easier for rework personnel to identify the correct connections.
A rework plan must also be in place for removing and reattaching components on dynamic flex circuits. This can be difficult because the flex circuits are covered in anti-corrosion protection films. The rework procedures must be designed to remove the film without removing the components below it, other electronic devices or the rework location itself. Removing the protective film is a complex task and should be undertaken only by experienced rework technicians. The process can be done through chemical and solvents, micro grinding or mechanical methods.